Preview Questions PCB Assembly Technician | Role Specific Skill

Question 1: In the context of PCB fabrication, what does DFA stand for?

Which action should you take?

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Design for Automated functions

Direct Flow Analysis

Differential Flex Analysis

Design for Assembly

Question 2: Which of the following is an appropriate technique for soldering fine-pitch components?

Which action should you take?

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Use an extremely high temperature for faster flow

Use a fine-tipped soldering iron and ensure precision

Use large amounts of solder to fill gaps

Use a hot air rework station

Question 3: What technique is used to avoid thermal shock when soldering ceramic components?

Which action should you take?

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Flux application

Preheating

Rapid cooling

High soldering temperature

Question 4: What is the effect of incorrect grounding on PCB testing?

Which action should you take?

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Reduced signal noise

Stable voltage levels

Increased EMI

Higher impedance

Question 5: Which instrument is used to measure signal integrity in high-speed circuits?

Which action should you take?

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Logic analyzer

Spectrum analyzer

Oscilloscope

Multimeter

Question 6: Which of the following best describes a cold solder joint?

Which action should you take?

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A joint where the solder has flowed but doesn't adhere properly

A joint that has no flux left after soldering

A joint with excess solder and visible solder bridges

A joint where the solder has not flowed properly and looks dull