Preview Questions Electronics Assembler | Role Specific Skill

Question 1: Which of the following is the best method to ensure the accuracy of component placement on a PCB during assembly?

Which action should you take?

Choose only one option

Using a pick-and-place machine that accurately positions the components

Placing components manually without any verification steps

Using excessive heat to melt solder quickly, ensuring secure placement

Relying on the component's leads to fit correctly into the pads

Question 2: Which electrical test is primarily used to measure the integrity of a PCB's solder joints after component placement?

Which action should you take?

Choose only one option

High-voltage insulation resistance test

Impedance testing

Voltage drop test

Continuity test

Question 3: What is the function of a Work-in-Progress (WIP) inventory system in assembly line coordination?

Which action should you take?

Choose only one option

To store raw materials for future production

To monitor overall assembly line speed

To track and manage components between different stages of production

To monitor worker performance and attendance

Question 4: Which type of component placement error is most commonly identified by automated optical inspection (AOI)?

Which action should you take?

Choose only one option

Component overheating during placement

Misalignment of components

Insufficient solder paste application

Incorrect component type

Question 5: What is the role of "pickup delay" in preventing component misplacement during high-speed assembly?

Which action should you take?

Choose only one option

Reduces solder paste drying

Allows component stabilization

Reduces nozzle wear

Improves vision alignment

Question 6: What is the primary consideration when selecting a circuit board material for high-frequency circuits?

Which action should you take?

Choose only one option

Mechanical strength

Solderability

Heat resistance

Dielectric constant