Preview Questions Electronics Assembler | Role Specific Skill

Question 1: What is the recommended method for cleaning solder flux residues after soldering?

Which action should you take?

Choose only one option

Use a specialized flux remover

Use isopropyl alcohol and a brush

Use hot water and detergent

Use acetone and a clean cloth

Question 2: When assembling a multilayer PCB, what is the most critical factor to consider in terms of layer alignment?

Which action should you take?

Choose only one option

Ensuring the solder mask is applied only on the top layer

Ensuring that all vias are placed before the final layer is assembled

Ensuring the surface is clean before soldering

Ensuring that the layers are properly aligned before soldering to avoid shorts or misalignment

Question 3: How do you verify the coplanarity of fine-pitch components during placement?

Which action should you take?

Choose only one option

Optical comparator

Thermal imaging

X-ray inspection

Visual inspection

Question 4: What is the primary purpose of using Andon in an assembly line?

Which action should you take?

Choose only one option

Automate task handoff between stations

Alert supervisors of quality or workflow issues

Identify idle workstations

Signal machine failure

Question 5: Which material is commonly used for soldering iron tips to prevent oxidation and maintain tip longevity?

Which action should you take?

Choose only one option

Tin coating

Nickel plating

Stainless steel

Copper coating

Question 6: How can you minimize the occurrence of solder voids under large components like QFNs (Quad Flat No-Lead) during placement?

Which action should you take?

Choose only one option

Optimize stencil design for solder paste

Use lead-free solder

Increase reflow oven temperature

Use of stencils with larger apertures